HDI PCB
HDI Applications
High-density interconnect (HDI) PCBs, commonly found in SMT processing plants, represent one of the fastest growing technologies in PCBs. Because of their higher circuit density than traditional circuit boards, HDI PCB designs can contain smaller vias and capture pads, as well as a higher density of connection pads. HDI boards contain blind and buried vias and often contain microvias with a diameter of 0.006 or smaller.
By using HDI technology, SMT production designers can now place more components on both sides of the original PCB as needed. Now with the development of through-hole and blind-hole technology in pads, designers are allowed to place smaller components closer together in SMT chip factories. This means faster signal transmission and significantly reduced signal loss and crossover delays.
HDI PCBs often appear in mobile phones, touch screen devices, laptops, digital cameras, 4G network communications, and also play an important role in medical equipment.